Parameters |
Package / Case |
1152-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Frequency |
166MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
M2S100 |
JESD-30 Code |
S-PBGA-B1152 |
Number of Outputs |
574 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Interface |
CAN, Ethernet, I2C, SPI, UART, USART, USB |
Number of I/O |
574 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
574 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
FPGA - 100K Logic Modules |
Number of Logic Cells |
99512 |
Flash Size |
512KB |
Height Seated (Max) |
2.9mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 1152-BBGA, FCBGA package as per the manufacturer's specifications.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the SmartFusion?2 series.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.It is important to note that this SoC security combines FPGA - 100K Logic Modules.Housed in the state-of-art Tray package.574 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.At least 1.14V can be supplied as a power source.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 574 outputs, which is convenient.In order to operate system on chip, you will need 1.2V power supplies.Inputs are available on the SoC chip in the number of 574.System on chips of logic are comprised of 99512 logic cells.It has a 512KB flash.It is possible to find system on chips that are similar in specs and purpose by searching for M2S100.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100-FC1152 System On Chip (SoC) applications.
- RISC-V
- Personal Computers
- Healthcare
- Automotive gateway
- ARM processors
- Temperature Sensors
- Multiprocessor system-on-chips (MPSoCs)
- Industrial
- Medical
- Deep learning hardware