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M2S100-FC1152

0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S100-FC1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 281
  • Description: 0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S100
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 100K Logic Modules
Number of Logic Cells 99512
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 1152-BBGA, FCBGA package as per the manufacturer's specifications.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the SmartFusion?2 series.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.It is important to note that this SoC security combines FPGA - 100K Logic Modules.Housed in the state-of-art Tray package.574 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.At least 1.14V can be supplied as a power source.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 574 outputs, which is convenient.In order to operate system on chip, you will need 1.2V power supplies.Inputs are available on the SoC chip in the number of 574.System on chips of logic are comprised of 99512 logic cells.It has a 512KB flash.It is possible to find system on chips that are similar in specs and purpose by searching for M2S100.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.Based on the core architecture of ARM, the SoC meaning has a high level of performance.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S100-FC1152 System On Chip (SoC) applications.

  • RISC-V
  • Personal Computers
  • Healthcare
  • Automotive gateway
  • ARM processors
  • Temperature Sensors
  • Multiprocessor system-on-chips (MPSoCs)
  • Industrial
  • Medical
  • Deep learning hardware

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