Parameters |
Package / Case |
1152-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Terminal Finish |
TIN LEAD |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Frequency |
166MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
M2S100T |
JESD-30 Code |
S-PBGA-B1152 |
Number of Outputs |
574 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Interface |
CAN, Ethernet, I2C, SPI, UART, USART, USB |
Number of I/O |
574 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
574 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
FPGA - 100K Logic Modules |
Number of Logic Cells |
99512 |
Flash Size |
512KB |
Height Seated (Max) |
2.9mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 100K Logic Modules and that is something to note.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 574 inputs and outputs.A 1.2V power supply is recommended.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.Power supply should be at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 574 outputs.You will need to provide 1.2V power supplies in order to run system on chip.This SoC chip has a total of 574 inputs that can be used.There are 99512 logic cells in the logic system on chips.This flash has a size of 512KB.Search M2S100T for system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100T-1FC1152I System On Chip (SoC) applications.
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