Parameters |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Frequency |
166MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
M2S150 |
JESD-30 Code |
S-PBGA-B1152 |
Number of Outputs |
574 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Interface |
CAN, Ethernet, I2C, SPI, UART, USART, USB |
Number of I/O |
574 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
574 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
FPGA - 150K Logic Modules |
Number of Logic Cells |
146124 |
Flash Size |
512KB |
Height Seated (Max) |
2.9mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
Non-RoHS Compliant |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
1152-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.In addition, this SoC security combines FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 574.A power supply with a 1.2V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.In order to run it, it must be fed by at least 1.14V of power.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 574 outputs.You will need to provide 1.2V power supplies in order to run system on chip.On the SoC chip, there are 574 inputs available for use.The logic system on chips contain 146124 logic cells.A flashing 512KB appears on it.M2S150 will give you system on chips with similar specifications and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150-1FC1152 System On Chip (SoC) applications.
- Central alarm system
- Print Special Issue Flyer
- AC drive control module
- Three phase UPS
- Multiprocessor system-on-chips (MPSoCs)
- Mobile market
- Industrial sectors
- Sports
- Vending machines
- Industrial robot