M2S150-1FC1152I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 1152-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S150 |
| JESD-30 Code | S-PBGA-B1152 |
| Number of Outputs | 574 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 574 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 574 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.9mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 1152-BBGA, FCBGA to this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 150K Logic Modules.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 574 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.It is unsafe to operate the SoCs wireless at voltages above 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.There are 574 outputs available on this SoC.System on chip requires 1.2V power supplies.The SoC chip is equipped with 574 inputs.146124 logic cells are included in logic system on chips.This flash has a size of 512KB.M2S150 will give you system on chips with similar specifications and purposes.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.The SoC meaning is based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150-1FC1152I System On Chip (SoC) applications.
- AC-input BLDC motor drive
- POS Terminals
- DC-input BLDC motor drive
- Embedded systems
- Networked sensors
- Self-aware system-on-chip (SoC)
- Microprocessors
- Functional safety for critical applications in the aerospace
- Smartphone accessories
- Communication interfaces ( I2C, SPI )
