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M2S150-1FCG1152

0°C~85°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S150-1FCG1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 705
  • Description: 0°C~85°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

Details

Tags

Parameters
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status RoHS Compliant
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S150
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.Total I/Os on this SoC part are 574.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.If it has at least a 1.14V volt power supply, it can work fine.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 574 outputs.There is 1.2V power supply requirement for this system on chip SoC.574 inputs are available on the SoC chip.There are 146124 logic cells in the logic system on chips.The flash size of the SoC meaning is 512KB.By searching M2S150, you can find system on chips with similar specs and purposes.It operates at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S150-1FCG1152 System On Chip (SoC) applications.

  • Servo drive control module
  • Communication network-on-Chip (cNoC)
  • Temperature Sensors
  • Medical Pressure
  • Microcontroller based SoC ( RISC-V, ARM)
  • Flow Sensors
  • Robotics
  • Smart appliances
  • Body control module
  • Remote control

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