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M2S150-1FCS536I

536 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S150-1FCS536I
  • Package: 536-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 121
  • Description: 536 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 536-LFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 536
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B536
Number of Outputs 293
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 293
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 293
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Its package is 536-LFBGA, CSPBGA.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 150K Logic Modules and that is something to note.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 293 I/Os.It is advised to utilize a 1.2V power supply.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supply should be at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 536 terminations, which is great for system on a chip.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.This SoC chip is capable of having 293 outputs, which is convenient.This system on chip SoC requires 1.2V power supply at all.There are 293 inputs available on the SoC chip.Logic system on chips consist of 146124 logic cells.As for its flash size, it is 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150-1FCS536I System On Chip (SoC) applications.

  • Servo drive control module
  • Healthcare
  • Industrial transport
  • Published Paper
  • AC drive control module
  • Industrial automation devices
  • Three phase UPS
  • System-on-chip (SoC)
  • Vending machines
  • Avionics

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