M2S150-1FCV484I
| Parameters | |
|---|---|
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 273 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 273 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 273 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 3.15mm |
| Length | 19mm |
| Width | 19mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 484-BFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.Assigned with the package 484-BFBGA, this system on a chip comes from the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 150K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.273 I/Os in total are included in this SoC part.It is recommended to use a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.In order to run it, it must be fed by at least 1.14V of power.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 484 terminations, so system on a chip is really aided by this.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There is the option to have 273 outputs on this SoC chip.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 273 inputs is available.A logic SoC has 146124 logic cells.This flash has a size of 512KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150-1FCV484I System On Chip (SoC) applications.
- Digital Signal Processing
- Video Imaging
- Wireless sensor networks
- sequence controllers
- Measurement tools
- Cyber security for critical applications in the aerospace
- String inverter
- Servo drive control module
- Efficient hardware for training of neural networks
- Microprocessors
