Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
484-BFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
273 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
273 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
273 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 150K Logic Modules |
Number of Logic Cells |
146124 |
Flash Size |
512KB |
Height Seated (Max) |
3.15mm |
Length |
19mm |
Width |
19mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Its package is 484-BFBGA.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.One important thing to mark down is that this SoC meaning combines FPGA - 150K Logic Modules.Housed in the state-of-art Tray package.This SoC part has a total of 273 I/Os.It is recommended to use a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supply should be at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 484 terminations, which makes system on a chip possible.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 273 outputs.As far as power supplies are concerned, system on chip requires 1.2V.The SoC chip is equipped with 273 inputs.146124 logic cells are present in logic system on chips.A 512KB flash can be seen on it.This SoC processor also includes LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150-1FCVG484 System On Chip (SoC) applications.
- Microprocessors
- Level
- Defense
- Embedded systems
- External USB hard disk/SSD
- Personal Computers
- Samsung galaxy gear
- DC-input BLDC motor drive
- Automotive
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