M2S150-FCG1152
| Parameters | |
|---|---|
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S150 |
| JESD-30 Code | S-PBGA-B1152 |
| Number of Outputs | 574 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 574 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 574 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.9mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 1152-BBGA, FCBGA |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.Tray package houses this SoC system on a chip.574 I/Os in total are included in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supply should be at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 574 outputs available on this SoC.As far as power supplies are concerned, system on chip requires 1.2V.On the SoC chip, there are 574 inputs available for use.146124 logic cells are included in logic system on chips.This flash has a size of 512KB.By searching M2S150, you can find system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 166MHz.In terms of core architecture, the SoC meaning relies on ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150-FCG1152 System On Chip (SoC) applications.
- Smartphones
- Test and Measurement
- Multiprocessor system-on-chips (MPSoCs)
- POS Terminals
- Wireless networking
- Sports
- Efficient hardware for inference of neural networks
- Functional safety for critical applications in the automotive
- Healthcare
- Industrial sectors
