M2S150-FCV484I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 484-BFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 273 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 273 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 273 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 3.15mm |
| Length | 19mm |
| Width | 19mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.It has been assigned a package 484-BFBGA by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.273 I/Os are included in this SoC part.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 484 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 273 outputs is available.A power supply of 1.2V is required to run system on chip.This SoC chip has a total of 273 inputs that can be used.146124 logic cells are included in logic system on chips.There is a flash of 512KB on it.Additionally, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150-FCV484I System On Chip (SoC) applications.
- CNC control
- ARM processors
- POS Terminals
- Microcontroller based SoC ( RISC-V, ARM)
- Test and Measurement
- Vending machines
- Keywords
- Functional safety for critical applications in the aerospace
- Functional safety for critical applications in the industrial sectors
- Microcontroller
