M2S150T-1FC1152
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 1152-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S150T |
| JESD-30 Code | S-PBGA-B1152 |
| Number of Outputs | 574 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 574 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 574 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.9mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.According to the manufacturer, this system on a chip has a package of 1152-BBGA, FCBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.One important thing to mark down is that this SoC meaning combines FPGA - 150K Logic Modules.It comes in a state-of-the-art Tray package.This SoC part contains a total of 574 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 574 outputs.There is 1.2V power supply requirement for this system on chip SoC.There are 574 inputs available on the SoC chip.146124 logic cells are included in logic system on chips.As for its flash size, it is 512KB.By searching M2S150T, you can find system on chips with similar specs and purposes.166MHz is the wireless SoC's frequency.In terms of core architecture, the SoC meaning relies on ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150T-1FC1152 System On Chip (SoC) applications.
- Level
- Multiprocessor system-on-chips (MPSoCs)
- Networked Media Encode/Decode
- Automated sorting equipment
- Networked sensors
- Industrial automation devices
- Microprocessors
- Defense
- Medical Pressure
- Special Issue Editors
