M2S150T-1FCV484
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 484-BFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 273 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 273 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 273 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 3.15mm |
| Length | 19mm |
| Width | 19mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Assigned with the package 484-BFBGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 150K Logic Modules.Tray package houses this SoC system on a chip.This SoC part has a total of 273 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.If it has at least a 1.14V volt power supply, it can work fine.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.Having 484 terminations in total makes system on a chip possible.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.This SoC chip is capable of having 273 outputs, which is convenient.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip is equipped with 273 inputs for the user to choose from.System on chips of logic are comprised of 146124 logic cells.This flash has a size of 512KB.This SoC processor also includes LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150T-1FCV484 System On Chip (SoC) applications.
- System-on-chip (SoC)
- sequence controllers
- Published Paper
- Level
- Measurement testers
- Optical drive
- String inverter
- Networked Media Encode/Decode
- Cyberphysical system-on-chip
- Smart appliances
