Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
484-BFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
273 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
273 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
273 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 150K Logic Modules |
Number of Logic Cells |
146124 |
Flash Size |
512KB |
Height Seated (Max) |
3.15mm |
Length |
19mm |
Width |
19mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.It has been assigned a package 484-BFBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 273 I/Os in total.A 1.2V power supply is recommended.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.It is really beneficial to have system on a chip since there are 484 terminations in total.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.There are 273 outputs available on this SoC.There is 1.2V power supply required for system on chip.A SoC chip with 273 inputs is available to the user.146124 logic cells are included in logic system on chips.The flash size of the SoC meaning is 512KB.Additionally, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150T-1FCVG484I System On Chip (SoC) applications.
- Temperature Sensors
- AC drive control module
- Defense
- Optical drive
- Smart appliances
- Industrial transport
- High-end PLC
- Self-aware system-on-chip (SoC)
- Wireless sensor networks
- sequence controllers