banner_page

M2S150T-FC1152I

-40°C~100°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S150T-FC1152I
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 142
  • Description: -40°C~100°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 574
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 1152-BBGA, FCBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 150K Logic Modules.Housed in the state-of-art Tray package.In total, this SoC part has 574 I/Os.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 574 outputs.There is 1.2V power supply requirement for this system on chip SoC.574 inputs are available on the SoC chip.Logic system on chips features 146124 logic cells.As for its flash size, it is 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150T-FC1152I System On Chip (SoC) applications.

  • External USB hard disk/SSD
  • Wireless sensor networks
  • Digital Media
  • Temperature
  • Healthcare
  • Special Issue Information
  • Defense
  • Measurement testers
  • Mobile computing
  • Special Issue Editors

Write a review

Note: HTML is not translated!
    Bad           Good