Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
1152-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B1152 |
Number of Outputs |
574 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
574 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
574 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 150K Logic Modules |
Number of Logic Cells |
146124 |
Flash Size |
512KB |
Height Seated (Max) |
2.9mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 1152-BBGA, FCBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 150K Logic Modules.Housed in the state-of-art Tray package.In total, this SoC part has 574 I/Os.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 574 outputs.There is 1.2V power supply requirement for this system on chip SoC.574 inputs are available on the SoC chip.Logic system on chips features 146124 logic cells.As for its flash size, it is 512KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150T-FC1152I System On Chip (SoC) applications.
- External USB hard disk/SSD
- Wireless sensor networks
- Digital Media
- Temperature
- Healthcare
- Special Issue Information
- Defense
- Measurement testers
- Mobile computing
- Special Issue Editors