M2S150T-FCV484
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 484-BFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 273 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 273 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 273 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 3.15mm |
| Length | 19mm |
| Width | 19mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Assigned with the package 484-BFBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 150K Logic Modules and that is something to note.Tray package houses this SoC system on a chip.273 I/Os in total are included in this SoC part.It is recommended to use a 1.2V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.It can feed on a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.The system on a chip uses 484 terminations in total.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There is the option to have 273 outputs on this SoC chip.A power supply of 1.2V is required.On the SoC chip, there are 273 inputs available for use.System on chips of logic are comprised of 146124 logic cells.There is a flash of 512KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150T-FCV484 System On Chip (SoC) applications.
- Industrial
- Robotics
- Deep learning hardware
- Efficient hardware for training of neural networks
- Remote control
- Sports
- Apple smart watch
- ARM
- Medical
- Functional safety for critical applications in the automotive
