Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
484-BFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
273 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
273 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
273 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 150K Logic Modules |
Number of Logic Cells |
146124 |
Flash Size |
512KB |
Height Seated (Max) |
3.15mm |
Length |
19mm |
Width |
19mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Assigned with the package 484-BFBGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.Taking note of the fact that this SoC security combines FPGA - 150K Logic Modules is important.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 273 I/Os.It is recommended to use a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.system on a chip benefits from 484 terminations.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.It is possible to use this SoC chip with 273 outputs.System on chip requires 1.2V power supplies.273 inputs are available on the SoC chip.Logic system on chips consist of 146124 logic cells.There is a flash of 512KB on it.Moreover, this SoC processor comes with LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150T-FCVG484 System On Chip (SoC) applications.
- Medical Pressure
- POS Terminals
- Vending machines
- Robotics
- Mobile computing
- Automated sorting equipment
- Sensor network-on-chip (sNoC)
- System-on-chip (SoC)
- Cyberphysical system-on-chip
- Test and Measurement