M2S150TS-1FC1152I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 1152-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S150TS |
| JESD-30 Code | S-PBGA-B1152 |
| Number of Outputs | 574 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 574 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 574 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 150K Logic Modules |
| Number of Logic Cells | 146124 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.9mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1152-BBGA, FCBGA to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A key point to note is that this SoC security combines FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.574 I/Os are included in this SoC part.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.At least 1.14V can be supplied as a power source.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.Using this SoC chip, you have the option of having 574 outputs.This system on chip SoC requires 1.2V power supply at all.This SoC chip has a total of 574 inputs that can be used.Logic system on chips consist of 146124 logic cells.There is a flash of 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S150TS.At 166MHz, the wireless SoC works.Core architecture of ARM underpins the SoC meaning.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150TS-1FC1152I System On Chip (SoC) applications.
- Central alarm system
- ARM support modules
- Functional safety for critical applications in the automotive
- Multiprocessor system-on-chips (MPSoCs)
- Video Imaging
- Communication interfaces ( I2C, SPI )
- Robotics
- ARM Cortex M4 microcontroller
- AC-input BLDC motor drive
- Smartphones
