Parameters |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
1152-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-55°C~125°C TJ |
Packaging |
Tray |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
ECCN Code |
3A001.A.2.C |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B1152 |
Number of Outputs |
574 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
574 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
574 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 150K Logic Modules |
Number of Logic Cells |
146124 |
Flash Size |
512KB |
Height Seated (Max) |
2.9mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.The manufacturer assigns this system on a chip with a 1152-BBGA, FCBGA package.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.In general, this SoC meaning should operate at a temperature of -55°C~125°C TJ on a regular basis.There is one thing to note about this SoC security: it combines FPGA - 150K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 574 I/Os.A 1.2V power supply should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.If it has at least a 1.14V volt power supply, it can work fine.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip with 574 outputs is available.There is 1.2V power supply requirement for this system on chip SoC.There are 574 inputs available on the SoC chip.There are 146124 logic cells in the logic system on chips.This flash has a size of 512KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150TS-1FCG1152M System On Chip (SoC) applications.
- Transmitters
- High-end PLC
- Temperature
- Cyberphysical system-on-chip
- ARM processors
- Industrial sectors
- Medical
- Automotive gateway
- Sensor network-on-chip (sNoC)
- PC peripherals