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M82154G13

Telecom device


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-M82154G13
  • Package: 672-BGA
  • Datasheet: -
  • Stock: 533
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 672-BGA
Packaging Bulk
Published 2014
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant

M82154G13 Overview


Space is saved on the board by using the 672-BGA package.Telecommunications equipment is packed in the Bulk-way.A Surface Mount mounting type is used.

M82154G13 Features


Available in the 672-BGA package

M82154G13 Applications


There are a lot of NXP USA Inc. M82154G13 Telecom applications.

  • Fault Tolerant Systems
  • Digital Cross-connect Systems (DCS)
  • Channel Banks
  • Digital subscriber line access multiplexer (DSLAM)
  • Channel Banks
  • Intelligent PBX
  • Add/Drop multiplexers (ADMs)
  • CSU/DSU E1 Interface
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • E1 Multiplexer

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