Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 2-XFDFN, FCDFN |
Diode Element Material | GALLIUM ARSENIDE |
Operating Temperature | -40°C~125°C TJ |
Packaging | Tray |
Published | 2013 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | Solder |
ECCN Code | EAR99 |
Additional Feature | HIGH Q |
Capacitance | 350FF |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-N2 |
Number of Elements | 1 |
Power Dissipation-Max | 0.1W |
Diode Type | Single |
Capacitance @ Vr, F | 0.2pF @ 10V 1MHz |
Reverse Current-Max | 0.1μA |
Voltage - Peak Reverse (Max) | 20V |
Breakdown Voltage-Min | 20V |
Reverse Voltage (DC) | 14V |
Diode Capacitance-Nom | 0.35pF |
Diode Cap Tolerance | 14.2% |
Q @ Vr, F | 3000 @ 4V, 50MHz |
RoHS Status | ROHS3 Compliant |