MAX20323FENC+
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 12-XFBGA, WLPBGA |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tube |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Applications | Mobile Communications |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | MAX20323 |
| Analog IC - Other Type | POWER SUPPLY SUPPORT CIRCUIT |
| Current - Supply | 35μA~170μA |
| RoHS Status | ROHS3 Compliant |
MAX20323FENC+ Overview
Shipments can be made in the direction of Tube .It is packaged the power management in 12-XFBGA, WLPBGA for convenient transportation.The Surface Mount mounting method is universal for easy adaptation.Applications targeting this power management include Mobile Communications and others.The operating temperature of the power management ic should be set to -40°C~85°C TA to avoid mal-function.This power management uses 2.5V~5.5V voltage for work.Alternatively, you may search for MAX20323 to find more power ic's pin-to-pin solutions for your specific needs.As a POWER SUPPLY SUPPORT CIRCUIT analog IC, the instruments designs has received much praise.It is a 35μA~170μA power ic.
MAX20323FENC+ Features
Mainly used in Mobile Communications applications
Operating temperature: -40°C~85°C TA
POWER SUPPLY SUPPORT CIRCUIT analog IC
MAX20323FENC+ Applications
There are a lot of Maxim Integrated MAX20323FENC+Power Management applications.
- LTE modem
- WOA
- Printers
- Switches
- LP2996A: DDR1
- Industrial PC
- Electronic Test Equipment
- I/Os (FPGAs, ASICs, DSPs)
- Industrial Equipment
- Space satellite point of load supply
