MAX2669EWT+
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 6-WFBGA, WLBGA |
| Surface Mount | YES |
| Number of Pins | 6 |
| Published | 2012 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| HTS Code | 8542.39.00.01 |
| Max Power Dissipation | 840mW |
| Technology | BICMOS |
| Voltage - Supply | 1.6V~3.3V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 2.85V |
| Terminal Pitch | 0.4mm |
| Frequency | 1575.42MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Operating Supply Voltage | 2.85V |
| Temperature Grade | INDUSTRIAL |
| Current - Supply | 7.7mA |
| Gain | 17.7dB |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | GPS/GNSS |
| Noise Figure | 0.65dB |
| P1dB | -10dBm |
| Length | 1.27mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
