Parameters | |
---|---|
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-WFBGA, WLBGA |
Number of Pins | 6 |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Max Power Dissipation | 840mW |
Technology | BICMOS |
Voltage - Supply | 1.6V~3.6V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Number of Functions | 1 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.4mm |
Frequency | 1575MHz~1610MHz |
Pin Count | 6 |
Operating Supply Voltage | 3.3V |
Temperature Grade | INDUSTRIAL |
Number of Channels | 1 |
Test Frequency | 1575.42MHz |
Operating Supply Current | 7mA |
Nominal Supply Current | 4.5mA |
Gain | 18dB |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | GPS/GNSS |
Noise Figure | 0.75dB |