Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 8-UFBGA, WLCSP |
Surface Mount | YES |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Terminal Finish | TIN LEAD |
Technology | CMOS |
Voltage - Supply | 2.7V~5V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 245 |
Number of Functions | 1 |
Supply Voltage | 3V |
Terminal Pitch | 0.5mm |
Frequency | 100MHz~2.5GHz |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 8 |
JESD-30 Code | S-PBGA-B8 |
Qualification Status | COMMERCIAL |
Operating Temperature (Max) | 85°C |
Operating Temperature (Min) | -40°C |
Temperature Grade | INDUSTRIAL |
Current - Supply | 5.9mA |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | Cellular, TDMA, CDMA, GPRS, GSM |
Input Range | -45dBm ~ 0dBm |
Height Seated (Max) | 0.67mm |
Length | 1.52mm |
Width | 1.52mm |
RoHS Status | ROHS3 Compliant |