Parameters |
Mount |
Surface Mount |
Package / Case |
SOIC |
Number of Pins |
8 |
Packaging |
Tube |
Published |
2006 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
MATTE TIN |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Subcategory |
Power Management Circuits |
Technology |
BICMOS |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Pin Count |
8 |
Temperature Grade |
INDUSTRIAL |
Number of Channels |
1 |
Max Supply Voltage |
-80V |
Min Supply Voltage |
-10V |
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT |
Nominal Supply Current |
1.4mA |
Power Dissipation |
471mW |
Adjustable Threshold |
NO |
Length |
4.9mm |
Width |
3.9mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
MAX5936LAESA+ Overview
As part of the SOIC package, it is included.At the moment, there are 1 channels available.In the form of a Tube, it is packaged.8 terminations are present in total.Device DUAL is in the terminal position.In total, there are 8 pins on it.Hot-swappable device is necessary to use 8 pins in order to operate the device.As far as Power Management Circuits is concerned, this gadget is self-contained.Surface Mount is the direction in which it is positioned.In order to ensure stable operation, a maximum operating temperature of 85°C°C must be set.Hot-swappable device functions at a minimum working temperature of -40°C degrees Celsius in order to maintain reliabilHot-swappable devicey.There is a POWER SUPPLY SUPPORT CIRCUIT IC in this gadget, which is an analog IC.-80VV is the maximum supply voltage that it can handle.Using a low supply voltage, such as -10VV, will be feasible.
MAX5936LAESA+ Features
The terminal position of 8
MAX5936LAESA+ Applications
There are a lot of Maxim Integrated MAX5936LAESA+ hot swap controllers applications.
- Active current limit
- Raid
- Thermal limitation
- Other forms of communications infrastructure
- Microcontrollers
- Switch
- Server backplane system
- Continuous monitoring of device temperature
- Datacom
- Short circuit protection