Parameters | |
---|---|
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Weight | 540.001716mg |
Operating Temperature | -20°C~85°C |
Packaging | Tube |
Published | 2002 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Type | Thermocouple Conditioner |
Technology | BICMOS |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 245 |
Number of Functions | 1 |
Supply Voltage | 3.3V |
Terminal Pitch | 1.27mm |
Base Part Number | MAX6675 |
Pin Count | 8 |
Output Voltage | 2.6V |
Operating Supply Voltage | 5.5V |
Interface | SPI, Serial |
Max Supply Voltage | 5.5V |
Min Supply Voltage | 3V |
Operating Supply Current | 1.5mA |
Nominal Supply Current | 700μA |
Max Supply Current | 1.5mA |
Number of Bits | 12 |
Input Type | Logic |
Resolution | 1.5 B |
Height | 1.5mm |
Length | 5mm |
Width | 4mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |