Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Copper, Silver, Tin |
Mounting Type | Surface Mount |
Package / Case | 4-WFBGA, CSPBGA |
Surface Mount | YES |
Number of Pins | 4 |
Operating Temperature | -45°C~85°C |
Packaging | Tape & Reel (TR) |
Published | 2008 |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | Operational Amplifier |
Max Power Dissipation | 238mW |
Technology | BICMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Number of Functions | 1 |
Supply Voltage | 3.6V |
Terminal Pitch | 0.5mm |
Base Part Number | MAX9938 |
Output Voltage | 200mV |
Number of Circuits | 1 |
Operating Supply Current | 1.1μA |
Nominal Supply Current | 1μA |
Amplifier Type | Current Sense |
Common Mode Rejection Ratio | 94 dB |
Voltage - Supply, Single/Dual (±) | 1.6V~28V |
Input Offset Voltage (Vos) | 100μV |
Bandwidth | 125 kHz |
Gain Bandwidth Product | 125 kHz |
Neg Supply Voltage-Nom (Vsup) | -3.6V |
Supply Voltage Limit-Max | 30V |
-3db Bandwidth | 60kHz |
Height Seated (Max) | 0.67mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |