Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount, Through Hole |
Mounting Type | Chassis Mount |
Package / Case | Twin Tower |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2012 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | Solder |
Max Operating Temperature | 175°C |
Min Operating Temperature | -40°C |
Pitch | 4.2mm |
Terminal Position | UPPER |
Orientation | Straight |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PUFM-X2 |
Number of Contacts | 10 |
Number of Elements | 2 |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 5mA @ 20V |
Voltage - Forward (Vf) (Max) @ If | 800mV @ 200A |
Max Voltage Rating (DC) | 600.6kV |
Forward Current | 400A |
Output Current-Max | 200A |
Application | POWER |
Current - Average Rectified (Io) | 400A DC |
Forward Voltage | 800mV |
Max Reverse Voltage (DC) | 60V |
Average Rectified Current | 400A |
Number of Phases | 1 |
Peak Reverse Current | 1μA |
Max Repetitive Reverse Voltage (Vrrm) | 60V |
Diode Configuration | 1 Pair Common Cathode |
Max Forward Surge Current (Ifsm) | 3kA |
RoHS Status | RoHS Compliant |