Parameters | |
---|---|
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | Three Tower |
Diode Element Material | SILICON |
Packaging | Bulk |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PUFM-X3 |
Operating Temperature (Max) | 150°C |
Number of Elements | 2 |
Element Configuration | Common Anode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 3mA @ 30V |
Voltage - Forward (Vf) (Max) @ If | 580mV @ 150A |
Case Connection | ISOLATED |
Forward Current | 300A |
Operating Temperature - Junction | -55°C~150°C |
Application | POWER |
Max Reverse Voltage (DC) | 30V |
Average Rectified Current | 150A |
Number of Phases | 1 |
Diode Configuration | 1 Pair Common Anode |
Reverse Current-Max | 3000μA |
RoHS Status | RoHS Compliant |