Parameters |
Mounting Type |
Surface Mount |
Package / Case |
247-TFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Published |
2004 |
JESD-609 Code |
e1 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
247 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Applications |
Handheld/Mobile Devices |
HTS Code |
8542.39.00.01 |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
MC13783 |
JESD-30 Code |
S-PBGA-B247 |
Height Seated (Max) |
1.2mm |
Length |
10mm |
Width |
10mm |
RoHS Status |
ROHS3 Compliant |
MC13783VK Overview
Tray is acceptable as a shipping the power management method.A convenient transport package is provided in 247-TFBGA .The Surface Mount mounting method facilitates easy adaptation.The power management is targeted at Handheld/Mobile Devices and other applications.Keeping the operating temperature of the power management ic -40°C~85°C will prevent malfunctions.You can search MC13783 if you are looking for more power ic's pin-to-pin solutions.The power management is equipped with 247 terminals.
MC13783VK Features
Mainly used in Handheld/Mobile Devices applications
Operating temperature: -40°C~85°C
MC13783VK Applications
There are a lot of NXP USA Inc. MC13783VKPower Management applications.
- Standard notebook PC
- Industrial applications
- SSTL-18 Termination
- 4K Ultra High Definition (UHD) Display
- DSP
- Peripheral I/O Power
- System Thermal for Servers
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- LP2996A: DDR2
- SmartPhones