Parameters |
Mounting Type |
Surface Mount |
Package / Case |
247-TFBGA |
Supplier Device Package |
247-MAPBGA (10x10) |
Operating Temperature |
-40°C~85°C |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Handheld/Mobile Devices |
Base Part Number |
MC13783 |
RoHS Status |
ROHS3 Compliant |
MC13783VKR2 Overview
Ready for shipping the power management in Tape & Reel (TR) package.To facilitate transportation, it is packaged the power management in 247-TFBGA .The Surface Mount mounting method is universal for easy adaptation.It is intended to be used at Handheld/Mobile Devices as well as for other applications.The operating temperature of the power management ic should be set to -40°C~85°C to avoid mal-function.Getting more power ic's pin-to-pin solutions can be found by searching MC13783 .
MC13783VKR2 Features
Mainly used in Handheld/Mobile Devices applications
Operating temperature: -40°C~85°C
MC13783VKR2 Applications
There are a lot of NXP USA Inc. MC13783VKR2Power Management applications.
- Isolated DC-DC Modules
- Electronic Test Instrumentation
- Server Backplane Systems
- SSTL-3
- Desktop PC
- GPS
- Chromebook
- System Health Monitoring
- SmartPhones
- Automotive cluster