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MC13783VKR2

MC13783 Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MC13783VKR2
  • Package: 247-TFBGA
  • Datasheet: PDF
  • Stock: 504
  • Description: MC13783 Specialized Power Management ICs(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 247-TFBGA
Supplier Device Package 247-MAPBGA (10x10)
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications Handheld/Mobile Devices
Base Part Number MC13783
RoHS Status ROHS3 Compliant

MC13783VKR2 Overview


Ready for shipping the power management in Tape & Reel (TR) package.To facilitate transportation, it is packaged the power management in 247-TFBGA .The Surface Mount mounting method is universal for easy adaptation.It is intended to be used at Handheld/Mobile Devices as well as for other applications.The operating temperature of the power management ic should be set to -40°C~85°C to avoid mal-function.Getting more power ic's pin-to-pin solutions can be found by searching MC13783 .

MC13783VKR2 Features


Mainly used in Handheld/Mobile Devices applications
Operating temperature: -40°C~85°C

MC13783VKR2 Applications


There are a lot of NXP USA Inc. MC13783VKR2Power Management applications.

  • Isolated DC-DC Modules
  • Electronic Test Instrumentation
  • Server Backplane Systems
  • SSTL-3
  • Desktop PC
  • GPS
  • Chromebook
  • System Health Monitoring
  • SmartPhones
  • Automotive cluster

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