MC32PF1510A2EP
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 40-VFQFN Exposed Pad |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
| Voltage - Supply | 3.8V~7V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC32PF1510A2EP Overview
The way of Tray is acceptable for shipping the power management.Packing in 40-VFQFN Exposed Pad makes transportation convenient.The Surface Mount mounting method allows for easy adaptation.It targets applications such as Embedded Systems, Low-Power IoT, Mobile/Wearable Devices and others.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~85°C .3.8V~7V voltage is used for the operation of this power management.It has received much praise because it is a POWER SUPPLY MANAGEMENT CIRCUIT analog integrated circuit.
MC32PF1510A2EP Features
Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC32PF1510A2EP Applications
There are a lot of NXP USA Inc. MC32PF1510A2EPPower Management applications.
- LTE modem
- Automotive cluster
- FPGA
- Electronic Test Instrumentation
- DDR-II Termination Voltage
- Computing
- Wireless routers
- Storage Systems
- Telecommunication
- Cordless Phone Base Station
