Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
40-VFQFN Exposed Pad |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
Voltage - Supply |
3.8V~7V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC32PF1510A3EP Overview
It is acceptable to ship in the way of Tray .It is packaged the power management in 40-VFQFN Exposed Pad for convenient transportation.The Surface Mount mounting method is universal for easy adaptation.The power management is targeted at Embedded Systems, Low-Power IoT, Mobile/Wearable Devices and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~85°C to prevent malfunctions.3.8V~7V voltage is used for the operation of this power management.The IC has been praised a lot for its capability of being a POWER SUPPLY MANAGEMENT CIRCUIT analog instruments designs.
MC32PF1510A3EP Features
Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC32PF1510A3EP Applications
There are a lot of NXP USA Inc. MC32PF1510A3EPPower Management applications.
- Telecom Rectifiers
- Data Storage
- Power Supplies
- Networking Equipment
- Camera Power Applications
- SSTL-18 Termination
- Automotive Infotainment
- Electronic Test Equipment
- Peripheral I/O Power
- Space satellite point of load supply