Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
40-VFQFN Exposed Pad |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
Voltage - Supply |
3.8V~7V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC32PF1510A4EP Overview
Ready for shipping the power management in Tray package.The package is conveniently packaged the power management in 40-VFQFN Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.This power management targets at Embedded Systems, Low-Power IoT, Mobile/Wearable Devices and other applications.Keeping the operating temperature of the power management ic -40°C~85°C will prevent malfunctions.It works with 3.8V~7V voltage.As an analog IC with a POWER SUPPLY MANAGEMENT CIRCUIT value, the instruments designs has been widely praised.
MC32PF1510A4EP Features
Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC32PF1510A4EP Applications
There are a lot of NXP USA Inc. MC32PF1510A4EPPower Management applications.
- Portable Media Players
- FPGA
- Memory Power
- Automotive head unit
- Automotive Digital Cluster
- Automotive Advanced Driver Assistance System (ADAS)
- Digital Cores
- Optical imaging payload
- SSTL-2 WHITE SPACE
- System Health Prognostics