Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
40-VFQFN Exposed Pad |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
Voltage - Supply |
4.1V~6V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC32PF1510A6EP Overview
Using Tray as a shipping the power management path is acceptable.Packing in 40-VFQFN Exposed Pad makes transportation convenient.Surface Mount is an universal mounting way for easy adapting.It targets applications such as Embedded Systems, Low-Power IoT, Mobile/Wearable Devices and others.The operating temperature of the power management ic should be set to -40°C~85°C TA to avoid mal-function.4.1V~6V voltage is used for the operation of this power management.As an analog IC with a POWER SUPPLY MANAGEMENT CIRCUIT value, the instruments designs has been widely praised.
MC32PF1510A6EP Features
Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC32PF1510A6EP Applications
There are a lot of NXP USA Inc. MC32PF1510A6EPPower Management applications.
- SSTL-18 Termination
- LP2996A: DDR3L
- Automotive cluster
- Field Service
- Automotive Navigation Systems
- Storage Systems
- Set-Top-Box
- Cordless Phone Base Station
- FPGA, DSP Core Power
- WOA