Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
40-VFQFN Exposed Pad |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
Voltage - Supply |
3.8V~7V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC32PF1550A6EP Overview
Shipments can be made in the direction of Tray .It is packaged the power management in 40-VFQFN Exposed Pad for ease of transportation.The Surface Mount mounting method facilitates easy adaptation.It targets applications such as Embedded Systems, Low-Power IoT, Mobile/Wearable Devices and others.A temperature setting of -40°C~85°C is recommended to avoid malfunctions.The power management operates at a voltage of 3.8V~7V volts.It has received much praise because it is a POWER SUPPLY MANAGEMENT CIRCUIT analog integrated circuit.
MC32PF1550A6EP Features
Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC32PF1550A6EP Applications
There are a lot of NXP USA Inc. MC32PF1550A6EPPower Management applications.
- Applications Processors
- Storage Systems
- Field Service
- Docking station
- Automotive head unit
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- LP2996A: DDR1
- Automotive cluster
- Laser TV
- Standard notebook PC