Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
40-VFQFN Exposed Pad |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
Voltage - Supply |
3.8V~7V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC32PF1550A7EP Overview
It is acceptable to ship using the method Tray .It is packaged the power management in 40-VFQFN Exposed Pad for convenient transportation.An easy-to-adapt universal mounting system is provided by Surface Mount .The power management is designed for use with applications at Embedded Systems, Low-Power IoT, Mobile/Wearable Devices .A temperature setting of -40°C~85°C is recommended to avoid malfunctions.3.8V~7V voltage is used for the operation of this power management.The instruments designs is highly regarded as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC32PF1550A7EP Features
Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC32PF1550A7EP Applications
There are a lot of NXP USA Inc. MC32PF1550A7EPPower Management applications.
- DDR-II Termination Voltage
- Switches
- Digital Signage
- System Health Prognostics
- Cluster
- Chromebook
- Automotive Infotainment
- Motherboard
- Memory Power
- Netbooks