MC33FS4500CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4500CAE Overview
Tray is acceptable for shipping the power management.Packing in 48-LQFP Exposed Pad makes transportation convenient.Surface Mount is an universal mounting way for easy adapting.The power management is targeted at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.1V~5V voltage is used for the operation of this power management.
MC33FS4500CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4500CAE Applications
There are a lot of NXP USA Inc. MC33FS4500CAEPower Management applications.
- Camera Power Applications
- Servers
- Tablet PCs
- SSTL-2 Termination
- System Health Monitoring
- Production Test
- WOA
- Automotive Advanced Driver Assistance System (ADAS)
- Peripheral I/O Power
- DSP
