MC33FS4500CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4500CAER2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.The Surface Mount mounting method is universal for easy adaptation.Applications targeting this power management include System Basis Chip and others.A temperature setting of -40°C~125°C is recommended to avoid malfunctions.The power management runs on 1V~5V voltage.
MC33FS4500CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4500CAER2 Applications
There are a lot of NXP USA Inc. MC33FS4500CAER2Power Management applications.
- Hearing Aids
- LP2996-N: DDR1 Termination Voltage
- Tablets
- System Health Prognostics
- Wireless routers
- FPGA
- Networking Equipment
- Modules With Remote-Sense Capability
- Motherboard
- Radar system ECU
