MC33FS4500LAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4500LAE Overview
It is acceptable to ship using the method Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method is universal for easy adaptation.The power management is designed for use with applications at System Basis Chip .Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.The power management operates at a voltage of 1V~5V volts.
MC33FS4500LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4500LAE Applications
There are a lot of NXP USA Inc. MC33FS4500LAEPower Management applications.
- Docking station
- Networking Equipment
- Modules With Remote-Sense Capability
- Servers
- Storage Systems
- Supplement In-Circuit Tester (ICT) Access
- Automotive display
- WOA
- Digital Signage
- Industrial PC
