MC33FS4501NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4501NAE Overview
It is acceptable to ship in the direction of Tray .A convenient packaging is provided in the form of 48-LQFP Exposed Pad .For easy adaptation, Surface Mount is a universal mounting method.The power management is intended for use at System Basis Chip as well as other applications.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .As a result, this power management is powered by 1V~5V voltage.
MC33FS4501NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4501NAE Applications
There are a lot of NXP USA Inc. MC33FS4501NAEPower Management applications.
- Electronic Measurement Units
- Telecom Rectifiers
- Industrial PC
- HSTL Termination
- Hardware Monitoring for PCs
- SSTL-3
- SmartPhones
- DDR Termination Voltage WHITE SPACE
- LP2996A: DDR1
- LP2996A: DDR3
