MC33FS4501NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4501NAER2 Overview
It is acceptable to ship in the direction of Tape & Reel (TR) .For ease of transportation, it is packaged the power management in 48-LQFP Exposed Pad .For easy adaptation, Surface Mount is a universal mounting method.The power management is intended for use at System Basis Chip as well as other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.For its operation, this power management requires 1V~5V voltage.
MC33FS4501NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4501NAER2 Applications
There are a lot of NXP USA Inc. MC33FS4501NAER2Power Management applications.
- Hand-Held Systems
- Communications payload
- Hardware Monitoring for PCs
- SSTL-18 Termination
- Telecom Rectifiers
- Portable Systems
- Portable Navigation Devices
- Projection Mapping
- Office Electronics
- Port/cable adapters
