MC33FS4502CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4502CAE Overview
The way of Tray is acceptable for shipping the power management.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.Surface Mount is an universal mounting way for easy adapting.The power management is intended for use at System Basis Chip as well as other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.For its operation, the power management uses 1V~5V voltage.
MC33FS4502CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502CAE Applications
There are a lot of NXP USA Inc. MC33FS4502CAEPower Management applications.
- Telecommunication
- Memory Power
- Industrial Telemetry Applications
- Networking Equipment
- System Thermal for PCs
- Data Storage
- GPS
- Electronic Test Instrumentation
- Port/cable dongles
- Set-Top-Box
