MC33FS4502CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4502CAER2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is an universal mounting way for easy adapting.Among other applications, this power management targets System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.For its operation, the power management uses 1V~5V voltage.
MC33FS4502CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502CAER2 Applications
There are a lot of NXP USA Inc. MC33FS4502CAER2Power Management applications.
- Switches
- Automotive head unit
- Hand-Held Systems
- Equipment Run-Off of Battery Backup
- Storage Systems
- Power Supplies
- WOA
- Optical imaging payload
- SSTL-3 Termination
- Automotive display
