Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
48-LQFP Exposed Pad |
Operating Temperature |
-40°C~125°C |
Packaging |
Tray |
Published |
2017 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
System Basis Chip |
Voltage - Supply |
1V~5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33FS4502LAE Overview
Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method for easy adaptation.The power management is designed for use with applications at System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management operates at 1V~5V volts.
MC33FS4502LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502LAE Applications
There are a lot of NXP USA Inc. MC33FS4502LAEPower Management applications.
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Desktop PC
- SSTL-18 Termination
- Applications Processors
- Power Factor Correction
- LP2996-N: DDR1 Termination Voltage
- Power Supplies
- Automotive display
- DDR-II Termination Voltage
- Wireless routers