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MC33FS4502LAER2

1V~5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MC33FS4502LAER2
  • Package: 48-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 619
  • Description: 1V~5V Specialized Power Management ICs(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant

MC33FS4502LAER2 Overview


Shipments can be made in the direction of Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.For easy adaptation, Surface Mount is a universal mounting method.The power management is designed for use with applications at System Basis Chip .The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.The power management runs on 1V~5V voltage.

MC33FS4502LAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4502LAER2 Applications


There are a lot of NXP USA Inc. MC33FS4502LAER2Power Management applications.

  • DSP
  • Automotive camera module
  • Automotive head unit
  • Tablets
  • Cluster
  • Memory Power
  • Automotive Infotainment
  • HSTL Termination
  • FPGA, DSP Core Power
  • 4K Ultra High Definition (UHD) Display

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