Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
48-LQFP Exposed Pad |
Operating Temperature |
-40°C~125°C |
Packaging |
Tape & Reel (TR) |
Published |
2017 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
System Basis Chip |
Voltage - Supply |
1V~5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33FS4502LAER2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.For easy adaptation, Surface Mount is a universal mounting method.The power management is designed for use with applications at System Basis Chip .The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.The power management runs on 1V~5V voltage.
MC33FS4502LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502LAER2 Applications
There are a lot of NXP USA Inc. MC33FS4502LAER2Power Management applications.
- DSP
- Automotive camera module
- Automotive head unit
- Tablets
- Cluster
- Memory Power
- Automotive Infotainment
- HSTL Termination
- FPGA, DSP Core Power
- 4K Ultra High Definition (UHD) Display