MC33FS4502NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4502NAE Overview
It is acceptable to ship in the direction of Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method allows for easy adaptation.The power management is designed for use with applications at System Basis Chip .Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.It works with 1V~5V voltage.
MC33FS4502NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502NAE Applications
There are a lot of NXP USA Inc. MC33FS4502NAEPower Management applications.
- Radar system ECU
- Hearing Aids
- Wireless routers
- LP2996A: DDR1
- Peripheral I/O Power
- Servers
- WOA
- LP2996A: DDR3L
- Production Test
- System Thermal for Servers
