MC33FS4503CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4503CAE Overview
Tray is acceptable as a shipping the power management method.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.For easy adaptation, Surface Mount is a universal mounting method.Among other applications, this power management targets System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.
MC33FS4503CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4503CAE Applications
There are a lot of NXP USA Inc. MC33FS4503CAEPower Management applications.
- System Health Prognostics
- Surround view system ECU
- Tablet PCs
- 4K Ultra High Definition (UHD) Display
- Telecommunications Equipment
- Termination Voltage
- GPS
- Industrial PC
- SSTL-3
- Automotive cluster
