MC33FS4503CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4503CAER2 Overview
It is acceptable to ship using the method Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method for easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.The power management operates at 1V~5V volts.
MC33FS4503CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4503CAER2 Applications
There are a lot of NXP USA Inc. MC33FS4503CAER2Power Management applications.
- Memory Power
- Server Backplane Systems
- Industrial applications
- Communications payload
- Portable Media Players
- System Health Prognostics
- Applications Processors
- DDR-II Termination Voltage
- Field Service
- LP2996A: DDR2
