MC33FS4503NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4503NAE Overview
Tray is an acceptable method of shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method allows for easy adaptation.This power management targets at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.
MC33FS4503NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4503NAE Applications
There are a lot of NXP USA Inc. MC33FS4503NAEPower Management applications.
- System Health Prognostics
- Portable Navigation Devices
- Industrial Equipment
- Digital Signage
- Industrial Telemetry Applications
- Switches
- Server Backplane Systems
- SmartPhones
- WOA
- LP2996A: DDR1
